1, the soldering effect is very good.
2, don't corrosive to IC and PCB.
3, the boiling point is only a slightly higher than the melting point of soldering tin
When soldering solder tin melted soon, it began boiling, absorption of heat and vaporization, can keep the IC and PCB at this temperature. When dismantle the chip, the solder paste use more. It can quickly melt and flow to the below of BGA chips.
PS, this is flux, if you buy it send by express, the safety check in can not pass it, so this flux can not send by express, please note, thanks.