1, the soldering effect is very good.
2, don't corrosive to IC and PCB.
3, the boiling point is only a slightly higher than the melting point of soldering tin
When soldering solder tin melted soon, it began boiling, absorption of heat and vaporization, can keep the IC and PCB at this temperature. When dismantle the chip, the solder paste use more. It can quickly melt and flow to the below of BGA chips.